SEM & EDX SEM (Scanning Electron Microscopy) Used to inspect the surface of devices at high magnification. DEX (Energy Dispersive X-Ray) Used as a microanalysis system coupled with SEM for element analysis and contamination.

X-Ray Thickness Measurement Workstage : 400 *450mm  Coating thickness measure and composition analysis.

X-Ray Television Inspection System Working stage : 350 * 300mm / 2 Kg  X-Ray output: 130 KV / 130uA Focus size : Min. 1um

Hardness Tester Inspection Mode : HV / HK X-Y stage max. movement : 25 * 25mm

Projector Workstage : 203.5*101.6*54mm Projection Lense : *10 / *50 Measurement : Length and Angular Resolution : 1um / 0.1 deg

Pull and Shear Force Tester Working stage : 50*50mm Force gauge : 0~5 Kg / 1~100 Kg Working spedd : 12.5 ~ 331 mm/min

Electro Press Pressing force : 1~1000 Kg (0.1 Kg) Working distance : 0 ~100mm Min. pressing space : 0.001mm Press speed : 0.1~35mm/S Connect with computer real time record pressing force.

Viscometer Accuracy : +/- 1% full scale range

FEA Modeling Stress Analysis-Dynamic

FEA Modeling Stress Analysis Result